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> Strumenti Attrezzi > Attrezzi > Chip saldatura > Chip saldatura Apple > BGA Reballing Stencil Mijing IPH-22 for Apple iPhone 16 Series CPU
BGA Reballing Stencil Mijing IPH-22
for Apple iPhone 16 Series
The Mijing IPH-22 BGA Reballing Stencil is a high-precision tool specially designed for the Apple iPhone 16 series,
ensuring perfect alignment and flawless soldering of each contact point. Made from high-temperature and deformation-resistant materials,
this stencil guarantees long-term stability and reliability, even in the most demanding reballing operations.
Its specially treated surface enhances wear resistance, extending the stencil’s service life.
With an ergonomic design, it is easy to use and suitable for both experienced technicians and beginners, without requiring advanced professional training.
The precisely engineered hole layout improves soldering quality, helping to prevent short circuits and cold joints.
Ideal for fast and efficient repairs, the Mijing IPH-22 BGA Stencil delivers superior durability and performance in all iPhone 16 processor reballing tasks.
