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Bumblebee Stencil MaAnt
The MaAnt Universal BGA Stencil (0.3 / 0.35 / 0.4 / 0.5mm, IC) is designed for reballing and repair operations on integrated circuits commonly used in mobile phones.
Made from high-strength alloy steel, it provides precision, durability, and flexibility, ensuring reliable performance even under repeated use.
Its optimized design with rounded and chamfered square holes ensures uniform solder joints and prevents solder clogging,
resulting in professional and consistent reballing results.
Specifications:
- 3 hole positions and 4 different pitches, compatible with multiple IC sizes
- Mesh verified against original factory drawings for perfect alignment and accuracy
- Square holes with rounded edges and no burrs for uniform dimensions
- Black mesh with chamfered holes for smooth, round solder balls
- Material: high-strength alloy steel, resistant to heat and wear
- High flexibility - returns to its original shape after deformation
