XINZHIZAO Intelligent Mainboard Layered BGA Reballing Stencil for iPhone 12 Pro Max_Chip saldatura Apple_Chip saldatura_Attrezzi_Strumenti Attrezzi_newBest ricambi

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XINZHIZAO Intelligent Mainboard Layered BGA Reballing Stencil for iPhone 12 Pro Max

XINZHIZAO Intelligent Mainboard Layered BGA Reballing Stencil for iPhone 12 Pro Max

Codice prodotto:ECS060122
N. di click：930
Prezzo unità:
Quantità：
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XINZHIZAO Intelligent Mainboard Layered BGA Reballing Stenci for iPhone 12 Pro Max

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