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BGA Reballing Stencil Mijing IPH-21
for Apple iPhone XS - 16 Series, IC
The Mijing IPH-21 BGA Reballing Stencil is a high-precision tool specifically designed for Apple iPhone models ranging from XS to 16 Pro Max.
It ensures exact alignment and perfect soldering of every solder joint, delivering superior quality during the repair process.
This multi-functional stencil is compatible with various chips including baseband, hard disk, WiFi, and NFC, significantly enhancing repair efficiency.
Made from high-temperature-resistant, non-deforming materials, it offers long-term stability and reliability even under heavy use.
Its user-friendly design allows operation without advanced professional skills, making it suitable for all technicians.
With precisely engineered holes, the stencil improves soldering quality, preventing short circuits and cold joints.
It also withstands high temperatures during soldering without losing its shape.
